Feb 13, 2001 IPC- Association Connecting Electronics Industries® has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections.
This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.
The 2000/2001 Technology Roadmap dovetails with the two other major electronics roadmaps in the United States, the National Electronics Manufacturing Initiative (NEMI) technology roadmap for the OEM customer and the International Technology Roadmap for Semiconductors (ITRS) roadmap.
More than 60 organizations contributed to the production of the 2000/2001 Technology Roadmap. It is divided into six easy parts to help readers understand the principals necessary to make the implementation strategies successful.
- Present situation in the electronics industry- Many OEMs are outsourcing, thus the business and technology sectors are extremely important to determine what one should do in preparing for future business and technology innovation.
- Related technologies- This includes design issues facing printed circuit board assembly designers and the way they interface with potential suppliers of the boards and the assemblies. A new cost model bridging the gap between design and manufacturing is also included.IPC 2000/2001 TECHNOLOGY ROADMAP, Pg. 2
- Component technology issues- This section defines the relationship between building components and using components.
- Component packaging manufacture- The format for the component package may be varied, however, the material and dimensional characteristics must provide the solutions to cost-effective component manufacturing.
- Electronic assembly manufacturing issues- One major component of the assembly is the interconnecting structure. This is the board, rigid flex, ceramic, or high density interconnect (HDI) being used to interconnect various parts.
- Environmental, health and safety system reliability and architecture- Additional input necessary to provide the details for future characterizations. This section also contains information on optoelectronics.
"These are just a few of the many areas of interconnection technology that require additional research and development," said Dieter Bergman, IPC director of technology transfer. "This roadmap's creation represents a common vision within the industry to build a culture, within R&D, of urgency without crisis."
The 2000/2001 National Technology Roadmap for Electronic Interconnections is available on CD-ROM for $75 for IPC members, $150 for nonmembers. Print versions are $200 for IPC members and $400 for non members.
To order the 2000/2001 Technology Roadmap, contact IPC customer service at 847-790-5362.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its more than 2,700 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $44 billion US industry employing more than 400,000 people.
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