Mar 08, 2020 IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Topics for Technical Conference Papers and Professional Development Courses:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect Issues
- BTC/QFN/LGA Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- E-textiles
- Embedded Passive & Active Devices
- Environmental Compliance
- Electromigration
- Electronics Manufacturing Services
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- Failure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal
- Industry 4.0
- Integrity
- Lead-Free Fabrication, Assembly & Reliability
- Miniaturization
- Nanotechnology
- Optoelectronics
- PCB Fabrication
- PCB and Component Storage & Handling Performance
- Quality & Reliability
- Packaging & Components
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts are due June 20, 2020 and course proposals are due June 8, 2020. To submit an abstract or course proposal, visit www.ipcapexexpo.org/education/call-for-participation.
For more information on technical conference or professional development course participation, contact Brook Sandy-Smith, IPC technical education program manager at BrookSandy@ipc.org.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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