Apr 22, 2002 Northbrook, Ill.
IPC-Association Connecting Electronics Industries(r) honored 22 individuals at IPC Printed Circuits Expo(r) 2002, held March 24-28, 2002, in Long Beach, Calif., for their contributions to IPC and the electronics industry.
Ron Underwood, president of Circuit Center Inc., was presented IPC's Outgoing Chairman Award for his leadership, vision and dedication during his term as IPC chairman from January 2000 to December 2001. Underwood's IPC participation includes organizing the Interconnection Technology Research Institute (ITRI), creating and serving as the first chairman of IPC's government relations committee and forming the small PWB President's Council.
Don Dupriest, Lockheed Martin Missiles and Fire Control, was honored with the IPC President's Award for his ongoing leadership of the IPC D-30 Rigid Printed Board Committee and his past contributions to the formation of IPC-2221 for board design, IPC-6012 for rigid board performance and IPC-6013 for flexible board performance. This award is given to members who have exhibited ongoing leadership in IPC and have made significant contributions to the association and the electronics assembly industry.
Gene Weiner, president and CEO of Weiner Associates, Inc., received the Outgoing Chairman award for his leadership of the IPC Printed Circuits Expo Trade Show Subcommittee.
IPC also presented 19 volunteers with Distinguished Committee Service Awards at IPC Printed Circuits Expo 2002. This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.
The following members were recognized for their significant contributions to the Post Separation Task Group:
Susan Mansilla, Robisan Laboratory
Brian McCrory, Delsen Testing Laboratories
Werner Engelmaier, Engelmaier Associates, LC
Bill Birch, PWB Interconnect Solutions Inc.
Bob Neves, Microtek Laboratories
Randy Reed, Merix Corp.
Billy Lung, Lucent Technologies
For their diligent work on IPC-4101A, Specification for Base Materials for Rigid and Multilayer Printed Boards, the following were also presented Distinguished Committee Service Awards:
Doug Sober, Essex Technologies Group
Rick Gargus, Neltec Inc.
Daniel Welch, Arlon MED
Dewey Whittaker, Honeywell Inc.
The following members were recognized for their significant efforts on IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards:
Donald Cullen, MacDermid Inc.
Bruce Houghton, Celestica Inc.
Gerard O'Brien, Photocircuits Corp.
Kuldip Johal, Atotech USA Inc.
Georg Milad
The following three additional members were honored with Distinguished Committee Service Awards for their individual work on various programs:
Robert Konsowitz, GIL Technologies, for his leadership in the development of IPC-4103, Specification for Base Materials for High Speed/High Frequency Applications
Rene Martinez, TRW Electronics and Technology Division, for his leadership in the development of IPC-6018A, Microwave End Product Board Inspection and Test
John Lott for his leadership of the Environmental Health and Safety (EHS) Committee.
IPC is a U.S.-based trade association dedicated to the competitive excellence and financial success of its more than 2,600 member companies, which represent all facets of the electronic interconnection industry. For more information, visit http://www.ipc.org.
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