SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem

New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem

Oct 23, 2023

Today, IPC, in collaboration with other industry organizations and representatives from academia and government celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.

The MAPT Roadmap extends the work of SRC’s and Semiconductor Industry Association’s (SIA) 2030 Decadal Plan for Semiconductors. The Decadal Plan identified five seismic shifts in the industry related to smart sensing, memory and storage, communication, security, and energy efficient computing. The MAPT Roadmap summarizes the key drivers of technology progress, provides guidance for how to achieve the technical challenges outlined in the Decadal Plan, and strategizes for developing the workforce required to realize the promises of these innovations. These advances build upon breakthroughs in advanced packaging, 3D monolithic and 2.5D/3D heterogeneous integration, electronic design automation, analog and mixed signal processing, nanoscale manufacturing, new materials, photonics and MEMS integration, and energy-efficient computing.

SRC Chief Scientist and Director of the MAPT Roadmap, Dr. Victor Zhirnov, commented, “The commitment demonstrated by such a wide array of scientists, engineers, and researchers to the development and production of the MAPT Roadmap indicates the importance of such an effort.”

The MAPT Roadmap is framed around fundamental and practical limits of information and communications technology sustainability: energy, environmental, and workforce sustainability. “SRC has been and continues to be a tremendous resource for semiconductor R&D and workforce development. The MAPT Roadmap directly supports the CHIPS and Science Act, led by the U.S. Department of Commerce, in efforts to develop a robust domestic ecosystem,” remarked Dr. Todd Younkin, president and CEO of SRC.

Added Matt Kelly, IPC chief technology officer and vice president of technology solutions and co-chair of roadmap chapter 8 committee on materials, substrates, and supply chain, “The MAPT Roadmap, a critically important effort, will guide the next decade of microelectronic needs and advancements. As the U.S. electronics sector faces significant challenges within the global market, it is crucial to develop strategies that foster growth, innovation, and competitiveness across this vital global industry – this roadmap provides this vision.”

Visit https://srcmapt.org/ to download MAPT Roadmap.


IPC (www.IPC.org) is a global, not-for-profit industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, advanced packaging, and testing. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.


Semiconductor Research Corporation (SRC.org), a world-renowned, high technology-based consortium, serves as a crossroads of collaboration between technology companies, academia, government agencies, and SRC’s highly regarded engineers and scientists. Through its interdisciplinary research programs, SRC plays an indispensable role in addressing global challenges, using research and development strategies, and advanced tools and technologies. Members of SRC work synergistically together, gain access to research results, fundamental IP, and highly experienced students to compete in the global marketplace and build the workforce of tomorrow.

Jun 03, 2024 -

North American EMS Industry Down 2.1 Percent in April

Jun 03, 2024 -

North American PCB Industry Sales Up 9.4 Percent in April

May 27, 2024 -

EWPTE 2024 Draws Nearly 3,000 Attendees

May 20, 2024 -

Electronics Industry Sentiment Falls in May After Hitting New High Last Month

May 06, 2024 -

Electronics Industry Sentiment Rose in April, Hitting New High

May 06, 2024 -

IPC's letter to Congress.

May 06, 2024 -

North American PCB Industry Sales Down 23.8 Percent in March

May 06, 2024 -

North American EMS Industry Down Four Percent in March

Apr 29, 2024 -

Record Numbers of Exhibitors to Showcase their Products and Services at EWPTE 2024

Apr 29, 2024 -

IPC Design Competition Champion Crowned at IPC APEX EXPO 2024

1489 more news from Association Connecting Electronics Industries (IPC) »

Jun 07, 2024 -

Revolutionizing Surfaces: The Art of Chemical Conversion Coating, Anodizing, Electroless Plating, and Electroplating

Jun 06, 2024 -

HELLER Partners With Circuit Technology, Restronics

Jun 05, 2024 -

Mencom Bolsters National Presence through a New Partnership

Jun 05, 2024 -

Motorcycle disc lock MK619, with 110-120 decibels electronic alarm system, mainly made of zinc alloy, copper, high material strength, effectively plays the function of dust-proof and waterproof, equip

Jun 05, 2024 -

Unleashing the Versatility: Exploring Silicone Rubber Applications

Jun 04, 2024 -

Guide to Metal Fabrications: Tailored Process to Production

Jun 03, 2024 -

PVA to Co-Exhibit with TKT Technology at EV Asia 2024

Jun 03, 2024 -

Accu-Assembly Inc. Expands Component Storage Management with AccuLiFT™ and AccuCart™ Products

Jun 03, 2024 -

TAGARNO Expands U.S. Operations with Enhanced Customer Support

Jun 03, 2024 -

North American EMS Industry Down 2.1 Percent in April

See electronics manufacturing industry news »

New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem news release has been viewed 126 times

  • SMTnet
  • »
  • Industry News
  • »
  • New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem
Jade Series Selective Soldering Machines

Conductive Adhesive & Non-Conductive Adhesive Dispensing