Apr 22, 2024 The Dieter Bergman IPC Fellowship award was presented to two IPC volunteers at IPC APEX EXPO 2024. The award recipients have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts. Tiberiu Baranyi and Zhiman Chen were chosen as award recipients as they embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. As part of the award, they bestowed Dieter Bergman Memorial Scholarships to the university or college of their choice.
Tiberiu Baranyi, a technology group manager at Flex, is a valued member of more than 25 IPC standards committees, serving as co-chair on several of them, including 7-31B IPC A-610 Task Group, 5-22A- EU J-STD-001 Task Group,7-31A, D-33A EU IPC-A-600 and IPC 6012 Task Groups, 7-34 EU, and 7-31F WHMA A-620 EU Task Group. He is a member of more than 40 different A-Teams and working groups for IPC and currently serves as Chair of the European Standards Steering Committee and vice-chair of the task group responsible for IPC-9726, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies.
Baranyi has chosen the Politehnica University of Timisoara, Department of Electronics, Telecommunications and Information Technologies as his Dieter Bergman Memorial Scholarship selection.
Zhiman Chen, Zhuzhou CRRC Times Electric Co., Ltd., was also honored for her extensive knowledge and understanding of the industry and the development of standards. Chen participates in the global standardization activities of IPC, IEEE, and ISO/IEC. At IPC, she has served as a two-term member of IPC TAEC-Global, two-term chair of IPC Asian Standards Steering Committee and founding member of IPC’s China Intelligent Manufacturing Steering Committee co-chair of 7-24B, chair of 7-31F-Rail Transit Task Group and is active on many additional task groups.
Chen has also led the development of the first two IPC documents dedicated to rail transit: IPC-A-610GRail and IPC/WHMA-A-620CRail; guided the successful launch of new standards in advanced packaging: IPC-6921 for IC substrates, IPC-6931 for optical modules, and IPC-9541 for systems in package; and is dedicated to providing expertise for IPC webinars, and IPC EDGE, IPC’s e-learning platform.
Chen is committed to helping IPC Asian members better participate in and contribute to IPC’s global standardization and networks with leading players in industries and supply chains, enhancing influencer engagement, and promoting industrial associations, forums, and summits. In June, Chen will serve as a panelist on IPC’s Women in Engineering event, detailing her career journey and offering advice to emerging engineer participants. Chen has chosen Hunan Automotive Engineering Vocational College (HAEVC) to receive the Dieter Bergman Memorial scholarship.
“The recipients of this year’s Dieter Bergman Fellowship award epitomize the spirit of fellowship in leading and working with volunteers from around the world, and we are fortunate that they have chosen to share their considerable talent and expertise,” said John W. Mitchell, IPC president and CEO. “We are glad to be able to honor their volunteerism and assist future engineers with this award.”
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its more than 3,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, and testing. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.
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