Apr 22, 2003
�High Speed Transmission Line Requirements�Impact on Performance, PCB Layout, Fabrication and Reliability,� authored by Ciena Corporation�s Subhash Pochareddy, Lavanya Gopalakrishnan and Rajat Srivastava, received this year�s award.
In addition, IPC recognized �Improvements in Polymer Thick Film Resistor Technology,� as an honorable mention. Troy Bachman, PolyMore Circuit Technologies, L.P., and Gregory Dunn, John Savic, Remy Chelini and Tim Dean of Motorola, Inc., co-authored this paper.
Ciena Corporation�s winning paper received $1,000 and a commemorative plaque from IPC.
Copies of the winning paper are included in the IPC Printed Circuits Expo 2003 Technical Conference Proceedings and can be purchased and downloaded through the IPC Online Store at http://www.ipc.org/onlinestore.
For more information on the authors, contact IPC Communications Manager Joe Dudeck at JoeDudeck@ipc.org or 847-790-5371.
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.
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