May 01, 2003
Recently, IPC released its plan to co-locate the two exhibitions in 2004 in order to tighten the links of the supply chain. Through the restructured event, IPC will be able to better serve both the printed circuit board (PCB) and electronics manufacturing industries.
To participate in the industry�s premier conference on electronics manufacturing, a 300-word abstract that summarizes original and previously unpublished work and covers case histories, research and discoveries must be received by June 20, 2003. The selection process is competitive and sufficient detail needs to be included to allow the Technical Program Committee to assess content of the proposed paper.
Selected papers will be presented at the technical conference and published on a Proceedings CD, which is distributed to more than 1,500 companies and individuals. Presenters will be entitled to a copy of the Proceedings, a free one-day conference pass on the day of the presentation, discounted registration fees for the full conference and complimentary admission to the Exhibit Hall, including the show floor reception.
Papers are being sought on design, materials, assembly, processes and equipment in the following areas:
� Design
� PCB Fabrication
� Soldering (including lead free)
� Electromigration and Tin Whiskers
� Flexible Circuitry
� Packaging & Components
� Area Array�Flip Chip�0201
� Embedded Passive and Active Devices
� Via Plugging and other protection
� HDI Technologies
� Surface Finishes
� Black Pad
� Factory Automation
� Environmental Concerns
� Electronic Manufacturing Services
� Business and Supply Chain Issues
� Test, Inspection and AOI
� Performance, Quality and Reliability
� Optoelectronics
� High Speed, High Frequency and Signal Integrity
If an abstract is selected, technical papers will be due on December 5, 2003. Each paper should be a minimum of six pages in length, describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. In addition, 30-minute presentations should be non-commercial in nature and focus on technology rather than a company�s product. Papers deemed commercial by the Technical Program Committee are not acceptable.
IPC is also seeking proposals from individuals interested in teaching full- or half-day professional development courses on design, PCB and electronic manufacturing processes and materials to a class of up to 50 persons. Such proposals and course descriptions should be received by June 20, 2003, and a master copy of the course workbook must be submitted by November 21, 2003. An honorarium will be offered to all professional development instructors.
To submit an abstract online, visit http://www.goapex.org/html/CFPAPEX2004.htm or http://www.ipcprintedcircuitexpo.org/speaker/2004EXPOCFP.htm. For more information, contact IPC Communications Manager JoeDudeck at 847-790-5371 or JoeDudeck@ipc.org.
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.
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