Mar 31, 2011 The two-and-a-half-day event will provide participants with insights into the engineering and business challenges associated with the technology of flexible circuitry from key leaders in the industry, including Research In Motion (RIM), Lockheed Martin, Mayo Clinic, DuPont and Rockwell Collins.
The day-and-a-half conference portion of the event will begin June 22 with the keynote, "The Future of Flex — Opportunities and Challenges," presented by Phil Plonksi of Prismark Partners. Then, representatives from RIM, Lockheed Martin, Mayo Clinic and Delphi will discuss what they need from the supply chain during "Technology Requirements of the End User."
In addition, the conference will feature information on ground-breaking technologies. "Alternative Approaches to Copper on Polyester Flex Circuit Manufacture" will be presented by Joel Yocum of Alva Development. "Modular Interface Technologies for Flexible Circuits," will be presented by Dr. Werner Kuhr of Zettacore.
Attendees will also receive an update on the latest advancements on materials for flex during a panel featuring representatives from DuPont, Arlon and Tapco Circuit Supply. John Bauer of Rockwell Collins will present performance reliability data. Sharon Starr, IPC director of market research, will provide an overview of trends in the flex market based on new IPC studies.
Other highlights of the conference portion include presentations on assembly issues in flex, solving processing issues, flex as an enabler for 3-D packaging and heater flex circuits for medical applications.
For those seeking more in-depth training on flex issues, three workshops will be held on Tuesday, June 21, the day before the conference begins. For individuals new to flex circuit fabrication, a primer workshop will provide a comprehensive overview of the process. Discussions will surround the differences in materials qualifications, such as those outlined in IPC standards; the various constructions and applications and why class is so important; and provide insight into what the flexible circuit board buyer is looking for.
For more experienced participants, the workshop on Special Considerations in Flex/Rigid Flex, will relay real-life, practical knowledge to engineers, fabricators, and designers. Covering the major fabrication process elements, the presentation will include recommendations for raw materials, constructions, bookbinders and design/assembly/test considerations.
The afternoon workshop, Design for Manufacture: Options for Optimum Manufacturing Reliability, will cover the realm of flexible printed circuits: dielectric material options, bonding methods, construction and actual detailed requirements for successful design and manufacture. Emphasis will be on circuit reliability for applications in medical, military-aerospace, commercial and automotive market sectors.
For more information or to register for IPC International Conference on Flexible Circuits, visit http://www.ipc.org/flexible-circuits.
IPC (http://www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,800 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
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