May 30, 2003 The new SG package allows the magnet to sit closer to the IC than it does in conventional packaging, allowing it to work with a higher airgap and smaller magnet.
The resultant compact package fits easily into the tight spacing dictated by automotive applications such as ABS systems.
Additional benefits are realised in the SG package through the use of a single-step moulding operation, which eliminates the possibility of voids caused by air entrapment during the potting process and results in improved heat dissipation.
A further improvement in heat dissipation is realised through the reduced heat-conduction path of the SG package.
Single-step moulding eliminates the layer of plastic normally placed between the integrated-circuit lead frame and the magnet, allowing operation at higher ambient temperatures because of the magnet's greater heatsinking capability.
The lead configuration of the SG package makes for easy PCB surface mounting and the simple attachment of a bypass capacitor.
The spacing provided between the two leads allows an axial-leaded capacitor to be welded across them.
Attachment to the sensor can also be made with a lead frame to preclude the use of a costly PCB.
Allegro MicroSystems
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