The IPC has developed the 9850 standard to encompass the parameters, measurement procedures and methodologies used for the specification, evaluation, and continuing verification of surface mount placement equipment.
It establishes the procedures to characterise and document the placement capability and performance of surface mount assembly equipment.
The IPC-9850 standard was developed by the SMT Component Placement Equipment Subcommittee of the Assembly Equipment Committee of the IPC.
Technology Information Corporation certifies that the IPC-9850 test materials kit meets the highly demanding specifications of the IPC-9850 standard.
Technology Information Corp