Jul 02, 2003 Bond-Ply 400 is designed to quickly and easily secure heatsinks and heat spreaders to BGA graphics processors, computer processors, power convertors, motor control PCBs, and other devices and parts with poor surface flatness.
On such low energy surfaces, the unsupported nature of the Bond-Ply 400 interface provides superior wet-out characteristics and thermal performance than would be possible using supported materials.
Supplied in sheet form, roll form, or as die-cut parts, Bond-Ply 400 is available with easy-release protective topside tabs that facilitate simple and rapid manual assembly.
Thermal performance is rated at 5.4C/W, and standard Bond-Ply 400 thicknesses range from 0.076 to 0.25mm.
The Bergquist Company
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