Nov 30, 2001 released by MYDATA automation. The tool, called H04, makes it possible to
handle cylindrical components such as MELF and SOD80 with the HYDRA
Speedmount head.
The H04 boosts machine throughput significantly for boards with cylindrical
components since the mounting can be done with the multi-nozzle HYDRA head,
instead of the MIDAS single-nozzle head.
In addition, the H04 provides improved handling of high chip components
that have a height/width ratio near or over 1. The tool consists of an
adapter and a specially designed rubber tool tip and can handle components
in the range 0603-1206 chips, MELF3514, SOD-80.
The H04 tool is fully compatible with the HYDRA Automatic Tool Exchanger
(ATE) and can therefore be mixed with other types of tools on the mount
head to optimize production and boost throughput further. The HYDRA ATE has
four different tool types (H01, H02, H03, H04) and enables the
eight-nozzled HYDRA Speedmount to mount components ranging from 0402 on 8
mm tape to SO14s on 16 mm tape with seamless tool changes,
The top mounting speed with the H04 tool ranges from 14 000 CPH to 21 000
CPH, depending on component type and application.
For more information, please contact Mats Magnell, Director of Marketing on
phone number: +46 8 475 57 62.
MYDATA automation designs, manufactures and markets surface mount assembly
machines. Its business mission is to satisfy the needs of the electronics
industry for SMT equipment, while meeting its demands for flexibility and
high quality production.
Sweden-based MYDATA offers a worldwide network of sales and service support
and has subsidiaries in Great Britain, France, the United States, Japan and
Singapore, with agents and distributors globally.
You can find further information about MYDATA at our website:
www.mydata.com.
