SMT, PCB Electronics Industry News

IDI Introduces Synergetix� Wafer-Level CSP Interposers

Nov 25, 2008

KANSAS CITY, KS � Interconnect Devices Inc., the world's leading manufacturer of spring contact probes, test sockets, and custom interconnect solutions announces the official release of Synergetix interposers for Wafer-Level Chip Scale Package (WLCSP) Testing.

The Synergetix test socket interposers are revolutionizing the testing of WLCSPs in vertical probing applications. With this technology rapidly emerging, IDI delivers a highly reliable, easily maintained, and eminently capable solution.

IDI interposers have a remarkably low cost of ownership beginning with their initial cost. The interposer consists of a plastic assembly containing IDI's proven semiconductor probe technology. Combined with an easy to design and fabricate load board, interposers require minimal attention throughout their extended life cycles.

WLCSP interposers are now available for use and feature several other significant benefits including:

- Lower initial investment

- Easy set-up and maintenance

- Extremely linear compression against the wafer leading to a longer mechanical life

- Particularly well suited for high current applications

- Average cleaning cycle every 50,000 touchdowns

- Contact replacement is rarely necessary before 500,000 tests

WLCSP Interposers have transformed the testing of WLCSP vertical probing applications to a new precedence compared to traditional technologies,� stated Mike Kirkman, President and CEO.

IDI is a leader in the design and manufacture of custom interconnects including high performance test sockets for the semiconductor industry and product connectors for the medical, military, aerospace, and telecommunications industries. For more information contact IDI at (913) 342-5544 , visit our website at http://www.idinet.com (for probes and connectors) or http://www.synergetix.com (for test sockets).

Nov 25, 2008 -

IDI Introduces Synergetix� Dyno� Contact for QFN Testing

Aug 16, 2024 -

Brooks Automation - Intrinsic Quality Partnership Announcement

Aug 16, 2024 -

New Business Region

Aug 14, 2024 -

ViTrox Recognized for Smart Manufacturing Leadership Award at MSMA 2023

Aug 14, 2024 -

ViTrox Partners with SMTo Engineering to Showcase Cutting-Edge SMT PCBA Solutions at SMTA Guadalajara 2024

Aug 12, 2024 -

Equipment Exchange Auction Happing Now

Aug 12, 2024 -

PVA to Exhibit at SMTA Guadalajara 2024, Showcasing Advanced Coating Technologies and Robust Support Network

Aug 12, 2024 -

Explore the Latest Innovations in SMT Material Handling from Inovaxe at SMTA Guadalajara

Aug 12, 2024 -

Altus Group Strengthens Support Excellence with New Team Member

Aug 12, 2024 -

Semi-Kinetics Expands Capabilities with Installation of Three Koh Young 3D Automated Optical Inspection Systems

Aug 12, 2024 -

SHENMAO Introduces Rosin-Free No-Clean Liquid Flux SM-ZR10 for Automatic Wave Soldering Process

See electronics manufacturing industry news »

IDI Introduces Synergetix� Wafer-Level CSP Interposers news release has been viewed 830 times

Reflow Oven