Oct 02, 2009 
As more functionality is included in integrated circuits, there is an increasing need to make extremely accurate voltage measurements or force extremely accurate voltages to perform tests, such as RDSON and VDO. The only way that these tests can be performed accurately and repeatedly in a high-volume test environment, over hundreds of thousands of insertions, is to contact the device through a Kelvin connection.
The challenge of wafer-scale test is performing final test, with its high currents, accurate measurement requirements, and full-speed functionality at the wafer level. This requires a high-performance contact method that fits into the wafer-probe environment. If Kelvin contact is required, the challenge is dramatically increased.
After outlining the issues related to Kelvin contacting for wafer-scale test, this presentation will provide a solution to these obstacles, and show that Kelvin solutions are not limited to coarse-pitch, singulated, or in-line devices such as QFPs, QFNs, and SOs. Probes and contactors that are proven production-worthy can be used for Kelvin contact to BGA devices, both singulated and at wafer-scale test, and a new design will extend the capability to finer pitches.
Everett Charles Technologies, Inc., a subsidiary of the Dover Corporation (NYSE: DOV), is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, Pogo? test contacts, and bare and loaded PCB test fixtures. ECT manufacturing, service, and support facilities are ISO registered with locations throughout the United States, Europe, and Asia. The company has been awarded numerous patents and participates actively in developing industry standards. Corporate offices for Everett Charles Technologies are located at 700 E. Harrison Ave., Pomona, California 91767. Additional information about ECT is available via the Internet at http://www.ectinfo.com.
