SMT, PCB Electronics Industry News

Valtronic Group Welcomes Its New CEO

Sep 03, 2015

Valtronic, contract manufacturer of miniaturized electronic products for trusted medical device partners, welcomes Rainer Platz as new Chief Executive Officer beginning November 1, 2015. Rainer Platz has spent most of his professional career in the microtechnology and medical device industry, where he has held various leadership positions comprised of R&D, technology and IP Management in both Switzerland and the United States. He has acquired experience in general management at the head of an active implantable medical device startup and most recently at the helm of Advanced Bionics’ North American operations. Rainer has a degree in Electrical Engineering from the University of Stuttgart (Germany) and a PhD from the Institute of Microtechnology, University of Neuchâtel and EPFL (Switzerland). Rainer holds dual citizenship in Switzerland and Germany, and speaks French, German and English.

Martin Zimmermann, former Group CEO, has been appointed as a Director of the Valtronic Board beginning August 1, 2015. Martin will continue to assist the Valtronic Group on its growth path and contribute to the implementation of our innovation strategy.

We cordially welcome Rainer Platz as our new CEO. With his medtech background, skills and strong management experience, we are convinced that he will further strengthen the Valtronic Group. His mid-term focus will be to continue to develop our business and increase customer satisfaction.

In the meantime, Stéphane Porchet, currently General Manager of our Swiss subsidiary, will assume interim management of the Valtronic Group.


We innovate and manufacture miniaturized electronic products for our trusted medical device partners. We produce integrated electronic and mechanical products. Our customers are leading global suppliers of medical implants and devices, diagnostic imaging equipment and sensitive aerospace and industrial assemblies. For over 30 years we have helped hundreds of companies develop and produce Class II & III medical devices and advanced miniaturized electronic assemblies.

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