Jun 30, 2009
Titled “How to Profile BGAs,” the Webinar will last 30 minutes and will highlight ways of successfully profiling BGAs. BGAs are becoming ever more difficult to properly reflow due to a whole host of challenges, such as BGAs relative thermal mass to other components, their relative position to other components on denser populated boards, differences in conductive materials such as ceramics and the tightening of overall reflow specs due to lead-free conversion. All of these new demands leave little room for error, thus the need for high-quality profiles.
During this Webinar, KIC will discuss various techniques for reliability profiling BGAs, such as thermocouple attachment. Also discussed will be some groundbreaking methods of BGA inspection, using the profiling process as one more tool in the arsenal to create a more robust inspection regiment for BGAs.
For more information, or to join the meeting on July 1, visit https://kicthermal.webex.com/kicthermal/j.php?ED=111785987&UID=0. The meeting number for this Webinar is 334 392 363.
Based in San Diego, KIC is the industry leader in automated thermal management tools and systems for reflow, wave, cure and semiconductor thermal processes. The company pioneered the development of oven profilers and process development tools, and then worked to create the next generation of thermal systems to help manufacturers optimize and monitor thermal processes.
In addition to KIC Explorer, products include the KIC 24/7 continuous monitoring system, the KIC Vision automatic profiling system and more. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and real-time thermal management systems, and has won numerous industry awards.
