Apr 01, 2021 
TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.
TopLine has employed substantial engineering resources in recent years to develop novel approaches to manufacturability and reliability of CCGA components that are usable with Field Programmable Gate Arrays (FPGA) and Application-Specific Integrated Circuit (ASIC) Packages.CCGA packages are assembled with solder column terminations that reduce stress in harsh environments, stresses resulting from wide temperature swings when mounting materials having different coefficients of thermal expansion (CTE) onto Printed Circuit Boards (PCBs).
Martin Hart, CEO, stated, “Our unique lead-free solder column is designed with an inner copper corethat prevents collapse of the semiconductor chip that also serves as a heat-sink toconduct heat from the underside of the CCGA package, resulting in enhanced reliability. The novel Pb-Free column structure conforms to RoHS directives that assure Restrictionof Hazardous Substances in electrical and electronic equipment. We’re pleased to have been awarded this patent.”
Interested parties are welcome to contact TopLine at info@topline.tv or by visiting the product Web Site directly at www.CCGA.tv.
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. For more information, call (1+) 800 – 776-9888.
