Oct 30, 2023 Martin Hart announces that his recent ground-breaking paper and presentation, titled “Next Generation Solder Columns Extend Life for Large Packages for Space Applications and Data Centers”, is available on the TopLine web site and is available for free download. It was presented by Hart at IMAPS 2023 in San Diego, California recently.
Hart’s paper compares the 40-year heritage of solder columns and their role in electronics packaging technology, with anticipated challenges to column technology demanded by increasingly larger packages and stress problems associated therewith. Hart looks at some of the exciting advances in columns and their potential to meet such challenges and extend component life for mission critical applications. “Braided Solder Columns, comprised of an Indium core and Niobium exoskeleton exterior, are capable of operating in minus 150C to minus 270C environments,” Hart says. “This may enable the development of packages that can reliably operate at extremely cold temperatures for Quantum computing, for example, and for applications such as deployment on the back side of the moon.” He added, “We had a robust attendance of CTOs and engineers interested to learn about the next generation solder columns to reduce stress and extend reliability for mission critical applications with super large BGA packages for Data Centers and space missions.”
To download the presentation for free, please visit https://www.topline.tv/CCGA_Solder_Columns_Next_Generation.PDF
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.
