Apr 24, 2002
Assembleon and Cookson Electronics' Speedline Technologies are forming an alliance that merges Assembleon's pick-and-place systems and processes and Speedline's expertise in equipment, systems and processes.
The alliance is expected to provide a range of services, extending from line and process design, materials evaluation, and total line installation up to single-point-of-contact ramp-up support, training, applications support, and ROA assessments. In addition, this partnership will marshall any resource required from within the technical capabilities of Royal Philips and the Cookson Electronics group.
"Our customers will find that this alliance is a strong platform for innovation in all aspects of the PCB manufacturing environment. We will offer contact know-how for the implementation of demanding component technologies such as flip-chips, 0201s, and optoelectronic technologies," said Cor Scholten, CEO, Assembleon.
