Siemens Dematic Forms New Advanced Assembly Technology Network

Siemens Dematic, known for its technology leadership, expands its advanced assembly technology services by forming the new SIPLACE Advanced Assembly Technology Network. Members of this global Advanced Assembly Technology Network include the Georgia Institute of Technology, George Brown College, Gwinnett Tech, Engent, Rochester Institute of Technology, Siemens Corporate Technology and Fraunhofer Institute in Germany for Europe. For Asia, negotiations with partners in China - Shanghai and Singapore are currently being conducted. "This Network will allow Siemens Dematic to leverage a network of world-class facilities and highly experienced teams to meet the needs of the industry", stated Ms. Manuela Sergizzarea, Global Manager of the Advanced Assembly Technology Services Network.

"With the formation of this Technology Network, we will be able to offer our customers improved quality, faster product introduction and process stabilization. Our experience in cutting-edge electronics manufacturing ensures our customers an integrated process development and implementation that takes into account the interaction of design, materials, equipment and processes."

The SIPLACE Advanced Assembly Technology Network will provide services covering all areas of assembly and packaging technologies including process development, reliability testing, semiconductor device and package qualification, process support and process consulting, materials qualification, new product introduction, prototyping, failure analysis and analytical services. In addition, technology training from industry experts will be offered through the Advanced Assembly Technology Network around the world.

To find out additional information about the newly formed Advanced Assembly Technology Network, Contact your local SIPLACE sales representative or visit our website at http://www.siplace.com.