Oct 07, 2011 
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that Michelle Ogihara, Senior Sales Director, will co-chair the Moisture Sensitive Device (MSD) Council meeting during the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The meeting will be held on Tuesday, October 18, 2011 at 2 p.m. in room 204A. Michelle will co-chair the meeting with Mumtaz Bora, Senior Packaging Engineer at Peregrine Semiconductor.
At the upcoming meeting, the council will discuss industry standards for moisture sensitivity packages including J-STD 033B.1, J-STD -020D.1 and package handling/baking/packaging guidelines. Additional topics to be discussed include PWB guidelines and updates to the IPC 1601 Standard.
The council is a voluntary group, under the auspices of the SMTA, dedicated to advancing the understanding and practice of moisture-sensitive devices control in electronics assembly procedures and practices.
The MSD Council serves industry professionals who are SMTA members that have an interest in moisture-sensitive devices. Specifically, the council represents engineering, production management, quality assurance and reliability, research, sales and marketing, education, purchasing, and other functions. For more information about the MSD Council, visit http://www.smta.org/msd/msd.cfm.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
