Feb 25, 2019 
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the new SPS-10 Solder Paste Softener from MALCOM.
MALCOM has introduced a new version of its proven solder paste softener that has been in use for many years. The updated system now can store up to nine condition settings, and the digital timer can be set in 10-second intervals.
The SPS-10 creates a centrifugal force that causes the solder paste to repeatedly fold over itself, thereby softening the paste and using friction to bring it up to room temperature. The system’s auto balance function will work with 500 g to 1 kg containers. Solder paste can be conditioned from the refrigerator to being prepared for production in approximately 10 minutes.
For more information, contact Michelle Ogihara at michelle@seikausa.com or visit www.seikausa.com. Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
