Mar 23, 2026 Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has received a 2026 NPI Award in the Process Control Tools category for its SAWA Automatic Stencil Inspection System T100.
The SAWA T100 introduces a fully automated, data-driven approach to stencil inspection—replacing slow, subjective manual checks with high-precision optical, laser, and tension-measurement technology. By integrating telecentric optics, closed-loop linear motor positioning, and automated GERBER comparison, the T100 establishes a new standard for stencil accuracy and lifecycle management in SMT production.
Unlike traditional inspection methods, the T100 tracks the entire stencil lifecycle—from arrival and production use to cleaning verification and eventual scrapping—delivering unprecedented traceability and actionable process data. Its advanced system detects aperture wear, burrs, foreign matter, deformation, and tension irregularities before they impact print quality, helping manufacturers prevent defects at the source.
The T100 ensures exceptional mechanical stability and long-term measurement accuracy. High-resolution industrial cameras (up to 100MP), precision grating rulers, and optimized LED illumination provide uniform, repeatable imaging capable of detecting apertures as small as 40µm. The system’s closed-loop positioning architecture guarantees consistent performance even in demanding, high-volume environments.
The T100 supports standard stencil sizes and frame types, connects easily with MES, GEM, and CFX factory networks, and utilizes Windows-based software for broad compatibility. Barcode-driven workflows align with common shop-floor tracking systems, while GERBER, CAD, and BOM comparison features allow engineers to use existing design files without disruption to upstream or downstream processes.
By combining inspection, tension testing, deformation analysis, and automated reporting within a single platform, the T100 significantly reduces labor hours and minimizes rework caused by missed stencil defects. MES integration and automated documentation also streamline audit preparation and administrative tasks, delivering measurable ROI.
In addition to inspecting new stencils and verifying cleaning quality, the system can measure frame deformation and analyze multi-point tension. Optional modules—including 3D stencil thickness measurement, scraper inspection, and flatness scanning—allow manufacturers to tailor the system to their specific production needs. Programmable GERBER tools and customizable functions make it adaptable to a wide range of stencil technologies and manufacturing strategies.
With automated focusing, offline programming, and linear motor motion control, the T100 performs rapid, high-precision inspections while reducing setup time and accelerating stencil turnover between runs. Its intuitive software interface, barcode-based job selection, and clear SPC dashboards ensure operators and engineers can quickly assess stencil condition and identify trends that impact print performance.
“By moving from manual inspection to automated, data-driven verification, manufacturers gain greater process control, improved yield, and longer stencil life,” said Michelle Ogihara, Executive VP, Seika Machinery. “We are honored that the 2026 NPI Awards have recognized this innovation.”
For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
