Sep 17, 2009
Sayaka Routers are the ideal solution for stress-free depanelization, providing a fixture-based highly efficient dust vacuum system. The routers provide clean and precise depanelization for densely populated PCBs, and the advanced image-processing software offers point-and-click operation for programming router paths. Additional features of Sayaka PCB Routers include automatic alignment compensation by CCD camera, user-friendly operation, extended bit life by automatic router bit depth adjustment, improved tact time, and a calibration-free linear robot. The table top models offer offline software programming.
Seika also will feature the McDry MB-302 Low Temp Baking Cabinet. The cabinet conforms to IPC-J-STD 033B specifications, maintaining a baking temperature of
40 degrees C and under 5 percent RH level to bake and recondition moisture-sensitive components. This versatile system also acts as a storage cabinet when not in baking mode.
Finally, HIROX Systems are dedicated digital microscopes, allowing a sample to be observed directly through a lens. The microscopes have been optimized for the characteristics of the imaging sensor — a flat, 2-D array with a known readout rate, response curve, pixel size, etc.
In a conventional microscope, the optics of the eye have to be figured into the design parameters and that requirement may be different from, and potentially conflict with, those that would produce optimal images with an electronic imaging sensor. Because the HIROX microscopes have been designed only for digital imaging, no compromises have been made to accommodate the eye’s optics. However, the systems are, in fact, often able to take advantage of sight physiology and visual signal processing to provide unique observational capabilities, i.e. 3-D rotational microscopy.
The HIROX MX-BGAZ II lens allows ball joints to be observed non-destructively. Additionally, a 3-D optical rotary ring enables 3-D observation. This lens incorporates special hardware, such as a prism tip with lighting and a cushion mechanism to ensure comfortable observation.
Furthermore, observation of the BGA exterior in detail helps specify various problems, such as overheating, oxidation, air foam formation, and their causes. The MX-BGAZ II allows inspection of the BGA ball’s upper and lower joints by changing the observation angle through the optical rotary ring. This information is useful in reviewing the temperature profiles.
For more information about any of these products, visit Seika in booth 617 at the show or visit http://www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
