Aug 26, 2010 
The HIOKI flying probe provides a variety of benefits over conventional testing machinery. Some of these benefits include jig-less inspection for quick setup and the proficient testing of mis-mounted components, faulty components, and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while still thwarting board damage through use of the soft-landing feature.
With its variety of measurement abilities for analyzing data and the high-quality speed of testing, the flying probe tester is a cost-effective way to efficiently and quickly assess any circuit board.
The Anritsu 3D Solder Paste Inspection System features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 sq cm/sec at 20 µm resolution; 13.8 sq cm/sec at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided regardless of the operator.
Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.
Product literature also will be distributed for all of Seika Machinery’s products. For more information about Seika’s full product line, visit Seika at the SMTA Capital Expo & Tech Forum or visit http://www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
