Sep 22, 2016 
Metcal today announced that Paul Wood, Advanced Product Applications Manager, will participate in an expert panel conducted by Global SMT & Packaging Magazine during SMTA International. The panel, entitled, “Rework and Repair – Challenges,” is scheduled to take place Wednesday September 28, 2016.
Reworking PCB assemblies is becoming increasingly challenging. This expert panel will discuss some of the techniques and processes for dealing with:
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Miniaturization
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Higher temperature materials
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Conformally coated boards and devices
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Sensitive devices
Mr. Wood is an industry expert in the BGA/CSP/Array package rework arena. With 34 years of service at OK International, Inc., and 43 years’ experience in the electronics industry, Mr. Wood has used his global experience in rework to keep electronic assembly manufacturers on the leading-edge of technology.For more information about Metcal, visit www.metcal.com.
Since 1982, Metcal has been a recognized worldwide leader in the electronics assembly marketplace. As part of OK International, Metcal’s industry-leading position addressing advanced technology in conduction soldering and rework/repair, has and will continue to broaden to a full electronics bench tool single-source solution. Metcal product lines currently include: hand soldering and desoldering, convection rework products, fume extraction and fluid dispensing tools. For more information, visit www.metcal.com.
