SMT, PCB Electronics Industry News

Metcal 2002 Roadshow

Mar 22, 2002

To

Demonstrate Brand New, Economical Rework and Optical Inspection Solutions

First UK Date: 10th April at Cwmbran, Wales

The successful rework of expensive assemblies is often critical to profitability. Companies are facing ever greater challenges when reworking components that are becoming increasingly miniaturised. Metcal have addressed these challenges with the very latest technology in array package rework and optical inspection.

At various venues throughout Europe, Metcal invite you to attend demonstrations of their brand new APR-5000 Array Package Rework System. An advanced, versatile system offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today�s leading-edge BGA, CSP, Land Grid Array (LGA), micro SMD, Micro-Lead Frame (MLF) and Bumped Chip Component packages.

Plus the advanced features and flexibility of the brand new VPI-1000 Optical Inspection system. Offering an economical inspection solution that gets tighter, closer and lower than any other optical system, for the inspection of BGAs, CSPs, LGAs, etc.

For further information please contact Metcal on +44 (0) 2380 489100 or via email: metcal@europe.com

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