Apr 10, 2002 Munich, Germany
Suss MicroTec Systems GmbH today said it plans to introduce a new automatic fusion-bond cluster tool, which is capable of processing two substrates simultaneously for high yield in fabs producing micro-mechanical devices, such as sensors and optical data processing components.
The CL200 will be introduced during next week's Semicon Europa trade show in Munich (April 16-18). The system has process control for clean, dry, align, and bonding in one closed chamber. The CL200 cluster consists of a cleaning/aligning and pre-bond module, combined with automated material handling and a station for infrared inspection. The system can be upgraded to a production cluster with a maximum of five CL200 modules, said the company.
"Silicon fusion bonding is an extremely fast, front-end compatible bond process, applicable on almost all wafer materials," said Christian Ossmann, manager of the business unit MEMS at Suss MicroTec. "Now with commercial systems available for high-yield processing, risk is nearly eliminated as the combined processes are well under control. With demand requiring a fully automated tool for production, an upgrade from a manual loading machine to a high-end production tool is easily transformed."
The new system will address a growing demand for silicon-on-insulator (SOI) wafers, according to Suss MicroTec. The CL200 cluster addresses the cleaning and pre-bond process for bonded silicon-on-insulator devices.
In the CL200, all process steps are carried out in one system with no additional wafer handling between cleaning and bonding. The closed chamber creates a mini-environment with a controlled gas atmosphere for optimum process conditions, said the company. The system handles most kinds of wafers from 2- to 8-inch including silicon, III-V compounds and glass.
