Oct 03, 2020 
SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS).The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
Watson Tseng, General Manager, stated: “We have received tremendous positive reviewssince we introduced our new room temperature solder paste and solder wire. Both products are trulyunique and we are honored to have them recognized by the industry.”
PF606-F13 is suitable for a variety of automatic soldering applications, including: TPC soldering, buzzer, bending element, LCD panel, embedded element, solder joints, wire soldering, button, screen connector and FPC soldering. The solder wire reduces the technical requirements of manual operation and enables mass production.
SHENMAO’s PF606-RT35 lead-free room temperature solder paste is specially designed to provide long-term stability over a wide range of temperature conditions. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
The GLOBAL Technology Awards have recognized the very best new innovations in the printed circuit assembly and packaging industries since 2005. The prestigious awards contest has been bringing together the global SMT and advanced packaging industry in a celebration of the companies and people that are achieving the highest standards and driving our industry forward. For more information, visit www.globalsmt.net/awards.
For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
