SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

SMEF-Z52 is an active epoxy flux designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator helps to eliminate solder balls and form smooth solder joints.

The epoxy flux residue is cured and provides mechanical support to the joint after reflow. Epoxy clad in solder joints after curing can protect these joints and increase joint strength by 30 percent compared to conventional rosin flux.

The newly designed SMEF-Z52 flux doesn’t require cleaning and has excellent compatibility with molded underfill (MUF) and capillary underfill (CUF). It is suitable for various IC packages, such as system-in-package (SIP), wafer-level-package (WLP) and flip chip.

The halogen-free (REL0) flux complies with RoHS, RoHS 2.0 and REACH. It is designed for use in stencil printing, dispensing, jetting, dipping and pin-transfer processes.

For more information, please visit www.shenmao.com.

SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.