Mar 18, 2024 
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Key Features of PF735-PQ10-10:
- Halogen-Free Composition: PF735-PQ10-10 is halogen-free (ROL0), with no halogen intentionally added. It complies with RoHS, RoHS 2.0, and REACH regulations, ensuring environmental sustainability and safety.
- Excellent Solderability: The solder paste exhibits excellent solderability, enabling reliable and robust solder joints in electronic assemblies.
- √Great Voiding Performance: PF735-PQ10-10 demonstrates outstanding voiding performance, minimizing defects and enhancing product reliability.
- Prevention of BGA/CSP Hot-Tearing: The solder paste helps prevent BGA/CSP hot-tearing, contributing to improved reliability and durability of electronic components.
- High-Speed Printability: With high-speed printability capabilities, PF735-PQ10-10 enhances production efficiency and throughput.
- Customizable Powder Size: Available in T4 to T6 powder sizes, PF735-PQ10-10 can be tailored to meet specific customer requirements.
With the increasing demand for ultra-thin packages, reducing package thickness can lead to warpage and production yield loss. PF735-PQ10-10 addresses this challenge by reducing the reflow temperature to below 190°C, compared to typical lead-free soldering temperatures of 240°C-250°C. This decrease in temperature helps minimize PCB and substrate deformation, saving energy, reducing thermal stability requirements, and increasing yield rates. PF735-PQ10-10 has already been successfully mass-produced in applications such as laptops.
PF735-PQ10-10 is suitable for a wide range of precise electronic products, including laptops, PCs, servers, and LED modules.
For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
