Oct 28, 2011 
ERSA, a leading supplier of soldering equipment, is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.
The ERSA Mobile Scope has been designed for optical inspection and digital image recording, including measurements of solder joints on BGA, μBGA, CSP and flip chip packages. Further applications are top-view inspection of PCB lands, solder paste prints or the optical inspection of components on printed circuit boards (PCBs) in Surface Mount Technology (SMT) or in Through-Hole Technology (THT). The device can be used in quality control, production, laboratories or R&D departments.
The compact ERSA Mobile Scope connects with a PC or any portable computer via a USB interface and is ready for operation within minutes in any location. By means of the high-quality BGA optical head, components with hidden solder joints can easily be inspected, the Macro-Zoom lens allows top-view surface inspection in various magnifications.
The ERSA Mobile Scope is compatible will ERSA’s patented, safe IR rework technology on the IR/PL 650, IR/PL 550 and IR/PL 650 XL. In addition to an outstanding cost/price ratio, the ERSA IR/PL 550 and IR/PL 650 have established their position in the market as being able to handle the toughest rework applications where other rework machines often fail.
Offer is valid in North America only while supplies last. For more information, contact Todd DeZwarte at 920-316-0215 or e-mail todd.dezwarte@kurtzersa.com
