Aug 30, 2013 
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry, is pleased to announce that Kalyan Nukala, M.S.Chem.Eng., Application Engineer, ZESTRON, will present “Determine Critical Cleaning Process Parameters for QFNs” at the SMTA Capital Expo and Tech Forum on September 10th. The SMTA Capital Expo and Tech Forum will be held at Johns Hopkins University/Applied Physics Lab, in Laurel, MD, from 9:00 AM to 3:30 PM.
Quad Flat No Leads (QFNs) packages are one of the fastest growing package types within the electronics industry. Complex package design combined with low standoff heights inhibits the complete removal of flux residues after the soldering process. Mr. Nukala will discuss the challenges to effectively clean underneath the QFN component body, and how partially removed residues can lead to component failure. Furthermore, he will present a technical study that determined the critical cleaning process parameters using a spray-in-air inline cleaner and an aqueous alkaline cleaning agent in order to achieve complete cleanliness underneath these devices soldered with both soluble lead free and no-clean lead free pastes.
For the full technical program or to register for this event, please visit SMTA.org.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
