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The Adaptsys Group to Demonstrate Inline Taping and Inspection Solutions at 2026 APEX EXPO

Feb 23, 2026

The Adaptsys Group will exhibit at the 2026 APEX EXPO, taking place March 17–19 at the Anaheim Convention Center, where the company will showcase automation solutions for inline carrier tape production and inspection. Live demonstrations will be available throughout the event at Booth 2720.

At the show, The Adaptsys Group will demonstrate Re-flex, the world’s only inline carrier tape forming system and a patented technology designed to integrate directly with automated tape-and-reel (T&R) machines. Unlike conventional approaches that rely on pre-manufactured embossed carrier tape, Re-flex forms carrier tape inline, on demand, as part of the packaging process.

Re-flex manufactures Re-flex embossed carrier tape on demand and supports integration with customers’ manufacturing environments through an optional API interface. This enables control and data exchange with MRP systems, delivering full traceability, real-time production data, and improved process visibility.

Also on display will be 3DInspect, the company’s automated carrier tape inspection system. 3DInspect simplifies the creation of Certificates of Conformance (CoCs) by replacing manual inspection and documentation with consistent, automated measurement and reporting. The system reduces the time required to generate a CoC from approximately 30 minutes to just one minute, while improving accuracy and repeatability.

While Re-flex and 3DInspect complement one another—one producing carrier tape and the other verifying it—each solution also serves independent applications and target markets, allowing manufacturers to adopt them separately based on specific production requirements.

Visitors are invited to Booth 2720 to see live demonstrations and speak with Adaptsys Group specialists about integration options and application requirements.

For more information, visit www.adaptsys.com.


The Adaptsys Group is an international provider of manufacturing automation solutions for the electronics, semiconductor, automotive, medical, aerospace, and related industries. The company designs, supplies, and supports a wide range of component handling and automation technologies from offices in France, Hungary, Germany, the United Kingdom, the United States, and Southeast Asia.

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