Apr 20, 2016 Tropical Assemblies team successfully implements Package-on-Package (PoP) technology in their manufacturing process during the first week of February 2016 to expand the existing capabilities of placing micro Ball Grid Arrays (BGAs), Chip Scale Package (CSP) with 0.2 millimeters and 01005 component sizes.
The technology provides a combination of traditional packaging and die -stacking techniques offering configuration options by stacking memory or mixed logic memory stacking.
The PoP packages are designed for portable electronic products that requires efficient memory architectures including multiple buses, increased memory density and performance.
