Jul 14, 2011 
Teradyne, Inc. announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package. All of the instruments are currently in use by Teradyne customers.
The new instruments for the UltraFLEX Test System include:
- UltraPAC80 - The UltraPAC80 is a high density, wideband AC Waveform source and capture option that supports up to eight source and eight capture channels, with coverage up to 80MHz. It also features dual-band source and capture per pin, on-the-fly waveform interpolation and decimation, and real-time data transfer to up to 16 independent DSP processing engines for optimum performance and throughput.
- UltraPin1600 - The UltraPin1600 is the third generation digital option for UltraFLEX, which doubles instrument pin count to 256 pins per slot and increases maximum data rate to 1.6Gbps. It also has new features including same-cycle source synchronous capability for high speed DDR test, hardware-based Protocol Aware capability and up to 18 time domains to enable Concurrent Test of complex devices.
- UltraSerial10G - The UltraSerial10G is a next generation, high speed serial option supporting up to 20 bidirectional ports which more than doubles the density of previous generation instrumentation. It also increases maximum data rate to 10.7Gbps. Each port on the UltraSerial10G also supports pattern, loopback and PRBS test, jitter injection, high speed eye diagram measurement, as well as hardware-based Protocol Aware functionality to test interfaces including PCI Express, Serial ATA and MIPI M-PHY.
- UltraVI80 - The UltraVI80 is a high-density device under test (DUT) power and embedded converter option designed to test portable power management devices and other high site count SOC applications. It features 80 pins per instrument, at up to one Amp per pin, and has innovative features including hardware-based spike check and per-pin converter test capability.
Both the UltraPin1600 and the UltraSerial10G have been designed to natively support the direct testing of protocol-based device interfaces. In addition to Teradyne’s powerful pattern generator functions, the instruments contain dedicated “Protocol Aware” (PA) hardware. This unique PA implementation allows the tester hardware to automatically adapt to frequency, timing and data latency of multiple interfaces on the DUT. It also enables test engineers to create test programs using higher-level commands, without the need for traditional digital patterns. This unique functionality vastly improves time to market, tester throughput and quality of test.
“This new suite of instrumentation for the UltraFLEX will enable our customers to dramatically increase equipment efficiency and reduce operational costs,” said Gregory Smith, Computing and Communications Business Unit manager, Teradyne. “In addition, new technologies including Protocol Aware promise a radical improvement in engineering efficiency which will bring customers' devices to market faster, even with the ever-increasing complexity of SOC devices in the high-end consumer, wireless and computing markets.”
Teradyne (NYSE:TER) is the leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2010, Teradyne had sales of $1.6 billion. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.
