SMT, PCB Electronics Industry News

Teradyne Users Group Conference Announces 2012 Call for Papers

Aug 30, 2011

The Teradyne Users Group (TUG) Conference was first incorporated by Teradyne customers in 1983. Each year the Users Group Conference is held at rotating locations within the U.S. This conference consists of technical papers, panel and poster sessions, as well as tutorials that present the latest in test technology.

The Teradyne Users Group (TUG) Conference was first incorporated by Teradyne customers in 1983. Each year the Users Group Conference is held at rotating locations within the U.S. This conference consists of technical papers, panel and poster sessions, as well as tutorials that present the latest in test technology.

The Teradyne Users Group (TUG) has announced the 2012 Call for Papers for its annual conference at the Hilton Head Marriott in Hilton Head, South Carolina on April 30 through May 2, 2012. The event provides Teradyne customers and engineers with knowledge, tools and techniques to enhance their jobs. A collection of technical presentations, workshops and round table discussions awaits attendees and presenters at the ATE industry’s longest running users group conference, now in its 29th year.

Did you tackle and solve a tough test challenge this year? Share your experience with your peers by submitting an abstract for TUG 2012

“Did you tackle and solve a tough test challenge this year? Share your experience with your peers by submitting an abstract for TUG 2012,” said Tom Munns, consultant, Texas A&M University and TUG 2012 chairperson. “We will be headed back to the sandy dunes of Hilton Head, South Carolina for a conference packed with best practices and solutions you can take back and apply to your daily work. The TUG 2012 Steering Committee is committed to developing a program that will give you the tools you need to succeed."

Submissions for papers will be accepted on Teradyne®, Nextest®, and Eagle Test® products as well as platform-independent test technologies. Abstracts and questionnaires are due on or before November 4, 2011. Tracks for this year’s conference include Defense & Aerospace, Digital, Mixed Signal, Power Management/Automotive, RF Wireless, and Test Infrastructure & Production. To view a list of hot topics and to learn more about submitting an abstract for the 2012 conference, please visit the TUG Web site at http://www.teradyne.com/tug.


The Teradyne Users Group (TUG) was started in 1983 by Teradyne customers as a way to share knowledge through technical papers, poster sessions and tutorials that present the latest in test technology. The event is open to all licensed users of Teradyne's test systems and software products and is held each year at rotating locations within the United States. TUG is managed by an annually elected steering committee of Teradyne users and Teradyne-appointed delegates.

Teradyne (NYSE:TER) is the leading supplier of Automatic Test Equipment used to test complex electronics used in the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2010, Teradyne had sales of $1.6 billion. For more information, visit www.teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.

May 27, 2024 -

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

19 more news from Teradyne »

Jul 15, 2024 -

Automatic Nozzle Height Adjustment Reduces Soldering Defects in Wave Soldering Processes

Jul 15, 2024 -

KIC to Exhibit at Four SMTA Expo & Tech Forums in August

Jul 15, 2024 -

BTU International Appoints E-Tronix as Its Representative in Six States

Jul 15, 2024 -

TAGARNO Achieves Record Sales in the US for Q2 2024

Jul 15, 2024 -

Register for ZESTRON's Upcoming Webinar on "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs"

Jul 15, 2024 -

SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification

Jul 15, 2024 -

Altus Enhances Sustainability with kolb's Recyclable Packaging

Jul 12, 2024 -

Feeder Finger Releases Leaderless Feeder for Europlacer

Jul 11, 2024 -

Approaching Shannon's Limit: KDPOF Evolves to KD

Jul 09, 2024 -

Guide to Sourcing Top-Quality Lighting from Asia

See electronics manufacturing industry news »

SMT spare parts - Qinyi Electronics

One stop service for all SMT and PCB needs