SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Teradyne Introduces LitePoint RF Instruments for J750 Wireless Test Solution

Teradyne Introduces LitePoint RF Instruments for J750 Wireless Test Solution

Apr 03, 2015

Teradyne Introduces LitePoint RF Instruments for J750 Wireless Test Solution

J750-LitePoint Solutions Lower Test Costs for Wireless Connectivity and RF SOC Devices

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NYSE: TER), a market leader in wireless device test, introduced its latest wireless test solution for the J750 test platform. This expands Teradyne's market-leading position by introducing LitePoint's IQxel-M8, IQxel-M and IQxstream instrument options for the J750. These options enhance the J750's test economics by further expanding its instrument portfolio and by leveraging the more than 4,000 750 family systems deployed worldwide. Teradyne has received orders from multiple customers for this next generation wireless test solution and it is currently in production at multiple manufacturing sites.

The J750-LitePoint solution addresses the technical and economic challenges of testing wireless connectivity and other RF SOC devices. Following the double digit growth of wireless enabled System-on-a-Chips, these instrument options provide the scalability and parallel test efficiency required to achieve lowest cost of test in high volume production. The solutions provide up to 32 independent RF ports for testing high device site counts. The system can be configured to run key RF performance tests such as error vector magnitude (EVM) for the latest connectivity and cellular modulation standards, leveraging LitePoint's RF measurement science. In addition, the product expands the J750 processing capability to achieve shorter test times by making use of LitePoint's dedicated DSP processor for backgrounding all RF computations. The LitePoint IQxel-M8, IQxel-M and IQxstream instrument options are offered with new J750 orders or as an upgrade to any existing system.

"Teradyne's J750 has been recognized as the leading solution for microcontroller, FPGA and digital audio/baseband testing, and now, with the addition of RF instrumentation, we further extend its value to our customers," said Jason Zee, Consumer and LPA Business Unit Manager at Teradyne. "The continued integration of wireless connectivity technology onto microcontrollers and other mobile devices requires production test equipment that can deliver the added RF measurement performance and still achieve a low cost of test. J750-LitePoint was designed to address this challenge."

May 27, 2024 -

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

19 more news from Teradyne »

Jul 15, 2024 -

Automatic Nozzle Height Adjustment Reduces Soldering Defects in Wave Soldering Processes

Jul 15, 2024 -

KIC to Exhibit at Four SMTA Expo & Tech Forums in August

Jul 15, 2024 -

BTU International Appoints E-Tronix as Its Representative in Six States

Jul 15, 2024 -

TAGARNO Achieves Record Sales in the US for Q2 2024

Jul 15, 2024 -

Register for ZESTRON's Upcoming Webinar on "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs"

Jul 15, 2024 -

SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification

Jul 15, 2024 -

Altus Enhances Sustainability with kolb's Recyclable Packaging

Jul 12, 2024 -

Feeder Finger Releases Leaderless Feeder for Europlacer

Jul 11, 2024 -

Approaching Shannon's Limit: KDPOF Evolves to KD

Jul 09, 2024 -

Guide to Sourcing Top-Quality Lighting from Asia

See electronics manufacturing industry news »

Teradyne Introduces LitePoint RF Instruments for J750 Wireless Test Solution news release has been viewed 989 times

  • SMTnet
  • »
  • Industry News
  • »
  • Teradyne Introduces LitePoint RF Instruments for J750 Wireless Test Solution
Sell Your Used SMT & Test Equipment

Capillary Underfill Dispensing