SMT, PCB Electronics Industry News

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

May 27, 2024

Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test equipment, today announced shipment of its 8,000th J750 semiconductor test platform. This milestone has been achieved with V-Test, a leading outsourced semiconductor assembly and test (OSAT) vendor in China.

Deployed at all the world's leading semiconductor chip manufacturers, the Teradyne J750 tester includes wafer sort and final test solutions for microcontroller units, wireless devices, image sensors, and more. J750 testers lead the industry in quality, time to market, and cost effectiveness, delivering higher throughput and increased site count, reducing single-site test time, and optimizing parallel test efficiency.

V-Test provides testing services and production capacity to top-tier fabless/design houses in China and overseas fabless companies. The company tests products ranging from consumer to automotive systems on chip (SoCs) across different end-product segments in automotive, computing, mobility, power, and consumer products. Its anchor customers run high-volume and high-mix products.

"Teradyne has been a valued and collaborative partner to V-Test since our founding seven years ago. They've been with us from the start, and we know from experience that Teradyne testers are up to the task," said Tony Pian, CEO of V-Test. "The J750 system's quality, reliability, and scalability in the MCU/SoC testing space make it our platform of choice. Through our investment in this stellar platform, we have the means to further grow our business and maintain a competitive position in the semiconductor test industry."

V-Test owns over 100 Teradyne SoC testers for volume production and test engineering, including one of the first UltraFLEXplus test systems shipped to China.

"The Teradyne team has worked diligently to partner with customers across the globe and equip them with testing solutions that are right for the increasingly diverse set of semiconductors," said Regan Mills, vice president and general manager of SoC product marketing at Teradyne. "This latest milestone celebrates that partnership and the impressive growth of V-Test, while raising their profile as an industry leader in the process."

Proven Platform and Award-winning Software

Teradyne's J750 family is a leading MCU device testing solution for automotive and consumer applications, as well as image sensor testing. Automotive semiconductor suppliers rely on the J750 to provide repeatable and reliable device test results. The J750 utilizes Teradyne's award-winning IG-XL software platform to help verify test programs critical for the automotive market. With a 'zero footprint' design, the J750 is the gold standard for test quality as semiconductor manufacturers pursue zero defects and multisite throughput.

In addition, the IG-XL software platform is critical for rapid program development. It automatically scales to support multisite testing, saving significant development time and cost, and enables thirty percent faster development of multisite test programs compared with competitive ATE software systems.

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 -

Registration Opens for 2015 Teradyne Users Group Conference

19 more news from Teradyne »

Jul 15, 2024 -

Automatic Nozzle Height Adjustment Reduces Soldering Defects in Wave Soldering Processes

Jul 15, 2024 -

KIC to Exhibit at Four SMTA Expo & Tech Forums in August

Jul 15, 2024 -

BTU International Appoints E-Tronix as Its Representative in Six States

Jul 15, 2024 -

TAGARNO Achieves Record Sales in the US for Q2 2024

Jul 15, 2024 -

Register for ZESTRON's Upcoming Webinar on "Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs"

Jul 15, 2024 -

SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification

Jul 15, 2024 -

Altus Enhances Sustainability with kolb's Recyclable Packaging

Jul 12, 2024 -

Feeder Finger Releases Leaderless Feeder for Europlacer

Jul 11, 2024 -

Approaching Shannon's Limit: KDPOF Evolves to KD

Jul 09, 2024 -

Guide to Sourcing Top-Quality Lighting from Asia

See electronics manufacturing industry news »

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment news release has been viewed 66 times

SMT feeders

Reflow Oven