Feb 09, 2012 
Europlacer Pick-and-Place Platforms Support High Mix PCB Production Requirements
Europlacer, a designer and manufacturer of comprehensive SMT pick-and place equipment for the global electronics industry, will demo its award-winning iineo II and XPii-II SMT pick-and-place platforms in booth number 3015 at APEX 2012 taking place on February 28 - March 1, 2012 in San Diego, CA.
With the pick-and-place machines in an in-line-configuration, Europlacer will demonstrate how the iineo II and XPii-II work together to offer a highly flexible, 60,000 CPH solution to meet growing customer demand for greater productivity, without typical [competitor] compromises.
Now with Europlacer’s highly advanced, real-time Auto Adaptive Sequencing, to automate placement sequence of large and small components included as standard, Europlacer continues to lead the market with dynamic, real-time solutions as part of its standard product suite.
Widely configurable for numerous requirements, the Europlacer iineo II offers the industry’s largest board size (24” W x 63”L) under ‘one roof’, along with expansive feeder capacity up to 264 x 8 mm + trays. With 2 placement heads, 24 nozzles, huge component range and enough capacity for a broad range of presentation media including tape and reel, trays, tubes, cut tapes and POP, the iineo II can be employed to achieve optimal production efficiency on complex boards with ease.
Intelligent feeders simplify set-up and rapid changeover, allowing users to produce a multitude of vastly different products on a daily basis. Powerful software enables operators to optimize for common setups, manage stock, monitor production, store production history for traceability and plan production while both linear motors and high-resolution, digital cameras ensure accurate placement for greater yields and output. Winner of the Global Technology, NPI and Frost & Sullivan Awards in 2008 through 2010, the iineo platform is more broadly flexible than all other pick-and-place machine technologies on the market.
The XPii-II is a smaller footprint, high speed, pick-and-place machine incorporating the same technologies as the larger footprint iineo platform. Intelligent trolleys and feeders, powerful software, high-resolution digital cameras and placement heads with advanced on-head optical component sensing are all shared and portable between both platforms. Dual 12-nozzle “Tornado” turret heads are more than 10% faster than standard 8-head turrets yet each nozzle on either turret is fully capable of processing 01005s to 4" long connectors.
When added in front of the iineo II, the XPii-II effectively doubles production line capacity without doubling required floor space and, as both machines have identical placement capability, dynamic program splitting ensures the combination is perfectly balanced. Each machine fully provides for tape and reel, matrix tray elevator and/or internal tray holder, tubes, cut tapes, waffle packs and POP fluxing. For more information on these and other Europlacer technology, stop by Booth #3015 at the IPC 2012 Apex show in San Diego, CA and visit www.europlacer.com.
Europlacer has been developing machines for SMT electronics assembly since the 1970s and invented the intelligent feeder concept in the 1980s. After acquisition by Blakell Europlacer in 1991, the company moved away from split-axis to the inherently more capable X-Y architecture that underpins the company’s pick-andplace machines today. Europlacer’s policy has been to ensure wherever possible that technology purchased many years ago, especially feeders, remain compatible with the latest pick-and-place equipment. Europlacer designs and manufactures a comprehensive range of highly flexible SMT pick-and-place systems for the global electronics industry. For more information, visit Europlacer’s Web site at www.europlacer.com.
