May 18, 2009
FCT's WS159 water-soluble solder paste offers best in class solder spread and wetting. It also features print volume consistency down to 12 mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. WS159 is fully cleanable, with the widest cleaning process window in its class.
WS159 is engineered to work with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes.
It is ideal for customers experiencing stencil life issues, post-cleaning residue/cosmetics issues, cosmetic (shine) issues, and boards with OSP, ENIG, Immersion Silver, and Immersion Tin finishes.
The water-soluble paste provides complete removal of flux residue, bright, shiny tin lead solder joints, and excellent solder spread on all common pad finishes. It also offers excellent post-reflow yields, providing best in class after exposure to extreme humidity conditions.
WS159 features high volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as excellent response to one-hour pause, after two knead strokes at 35-65 percent RH.
About FCT Assembly
FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C� lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit http://www.fctassembly.com.
