Mar 22, 2010 
FCT Assembly wanted to develop a robust paste that could be used with both the SN100C and SAC305. NL930PT is that and much more. This paste is not only very cosmetically appealing when used with the SN100C, but it also has excellent pin probability, good print release down to .55 SAR when used with the Slic Stencil and excellent wetting on all surface finishes. All this is accomplished without using any halides.
NL930PT features excellent wetting characteristics on all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, SN100C and HAL. The paste displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH).
This product is a drop-in vs. most pastes currently used, making it extremely user friendly. Additionally, the easy application solder paste delivers bright, shiny SN100C solder joints and excellent solder spread on all common pad finishes.
NL930PT features high-speed stencil printing up to 200 mm/sec with excellent low voiding performance that exceeds IPC Class III requirements. The paste also features enhanced tack performance and printer open time, as well as shiny solder joints when used with SN100C.
About FCT Assembly
FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C® lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit http://www.fctassembly.com.
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