SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

May 04, 2006

JEDEC and the International Electronics Manufacturing Initiative (iNEMI) today announced the availability of two documents intended to help manufacturers reduce the risk of tin whiskers in lead-free products. The first is JEDEC standard JESD201, "Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes," and the second is a JEDEC/IPC joint publication, JP002, "Current Tin Whiskers Theory and Mitigation Practices Guideline."

JESD201, developed by the JEDEC JC-14.3 Subcommittee on Silicon Device Reliability Qualification and Monitoring and the iNEMI Tin Whisker User Group, provides a uniform environmental acceptance testing and reporting methodology for tin whisker susceptibility of tin and tin alloy surface finishes used in the electronics industry. It is intended to be used with JESD22-A121, "Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes" (published May 2005, with a revision released in October 2005).

JP002 provides guidance in understanding the prevalent theories regarding tin whisker formation, the driving force behind tin whisker growth, and mitigation practices used to minimize whiskers. It serves as a source of background information for JESD22A-121and JESD201. The publication was developed by JEDEC's JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices in conjunction with the IPC 5-23e Tin Whiskers Guideline Task Group, and includes significant input from the iNEMI Tin Whisker Users Group.

"Although it is not possible to guarantee that whiskers will not grow under field conditions, the mitigation practices detailed in JP002, combined with the test and acceptance criteria outlined in JESD201, form the cornerstone of a three-fold strategy of mitigation practices, process controls and verification testing that helps to reduce the risks of tin whiskers," said Joe Smetana, principal engineer, advanced technology, for Alcatel and chair of the iNEMI Tin Whisker User Group. "This standard set of testing requirements and associated acceptance criteria are crucial to users, who want to ensure product reliability, as well as to suppliers, who can now proceed with one set of criteria to test and evaluate their finishes rather than trying to meet varying requirements from multiple customers."

"These joint documents will help the electronics industry move forward to implement reliable and compliant Pb-free products," said Bruce Euzent of Altera Corporation, chairman of the JC-14.3 Subcommittee on Silicon Device Reliability Qualification and Monitoring. "There was a tremendous amount of cooperative work throughout the worldwide electronics industry to develop these documents."

JESD201, JP002 and JESD22-A121 can be downloaded from the JEDEC website at:

http://www.jedec.org/DOWNLOAD/search/JESD201.pdf

http://www.jedec.org/DOWNLOAD/search/JP002.pdf

http://www.jedec.org/download/search/22a121-01.pdf

TIN WHISKER WORKSHOP

iNEMI, in conjunction with IEEE, CPMT and ECTC, is sponsoring the Third Tin Whisker Workshop on May 30 as part of IEEE's Electronic Components and Technology Conference (ECTC; http://www.ectc.net). The full-day workshop in San Diego, California, will provide an update on work that has been done in both the testing and modeling of tin whiskers. In addition, a roundtable discussion will provide insight into the intent of the JEDEC/IPC specifications and will also discuss implementation of the new standards. For more information about the tin whisker workshop, go to http://www.inemi.org/cms/calendar/06_ECTC_TW_Workshop.html

ABOUT JEDEC

JEDEC (www.jedec.org) is the leading developer of standards for the solid-state industry. Almost 2700 participants, appointed by some 270 companies, work together in 50 JEDEC committees to meet the needs of every segment of the industry, manufacturers and consumers alike. The publications and standards that they generate are accepted throughout the world. All JEDEC standards are available online, at no charge.

ABOUT INEMI

The International Electronics Manufacturing Initiative's mission is to assure leadership of the global electronics manufacturing supply chain. Based in Herndon, Va., the industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI tin whisker activities, visit http://www.inemi.org/cms/projects/ese/tin_whisker_activities.html.

###

Jul 01, 2024 -

iNEMI Announces Member Recognition Awards for 2024

Dec 25, 2023 -

5G/6G MAESTRO Publishes Materials Development and Electrical Test Roadmap

Jun 07, 2013 -

iNEMI Publishes White Paper Proposing a Methodology to Determine Risk of Counterfeit Use

May 23, 2013 -

iNEMI Webinar Will Share Tools Developed to Assess Risk of Counterfeit Components

May 14, 2013 -

iNEMI Publishes its Tenth Roadmap

Feb 06, 2009 -

iNEMI Survey Asks about Boundary Scan Adoption

Apr 23, 2008 -

iNEMI Roadmap Workshop

Mar 24, 2008 -

iNEMI Schedules Regional Roadmap Workshops

Nov 13, 2007 -

iNEMI Names Grace O�Malley Manager of Operations for Europe

Nov 02, 2007 -

Wiley-IEEE Press Publishes iNEMI Lead-Free Book

12 more news from iNEMI (International Electronics Manufacturing Initiative) »

Aug 26, 2024 -

North American EMS Industry Up 1.9 Percent in July

Aug 26, 2024 -

PVA Welcomes Rod Kasperson as Global Sales Manager

Aug 26, 2024 -

Seika Machinery Hosts Second Webinar on Process Control: Advanced Testing and Profiling Techniques

Aug 26, 2024 -

Libra Industries Welcomes Charlie Gaddis as Chief Financial Officer

Aug 26, 2024 -

IPC Partners with Stephen F. Austin State University's CARRI and the IPC Education Foundation for Workforce Development in Electronics Manufacturing

Aug 26, 2024 -

Silicon Mountain Contract Services Announces Preparation for ITAR Registration

Aug 26, 2024 -

Murray Percival Company to Exhibit at SMTA Michigan and Ohio Expos

Aug 26, 2024 -

Altus Strengthens its Partnership with Active-PCB Solutions Through Further Investment in Koh Young Technology

Aug 26, 2024 -

Count On Tools Introduces the Innovative ezCLIP System for PCB Magazine Racks

Aug 26, 2024 -

Libra Industries Appoints Robert Hermann as Chief Operating Officer

See electronics manufacturing industry news »

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline news release has been viewed 839 times

  • SMTnet
  • »
  • Industry News
  • »
  • JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline
Circuit Board, PCB Assembly & electronics manufacturing service provider

Reflow Oven