SMT, PCB Electronics Industry News

Reliability of Lead-Free Solder Joints in Thermal Cycling

Dec 30, 2011

Key Factors in the Selection of Lead-Free Solders

Nihon Superior Co., Ltd., a supplier of advanced soldering materials to the global market, announces that it will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”

Solder is used to connect electrical components to printed circuit boards to make functioning electronic devices.  Recently, there has been a significant increase in interest in eco-friendly hybrid and/or electric vehicles that can be exposed to extreme temperatures during service. Therefore, resistance of a solder joint to thermal fatigue is an important characteristic. 

Cross-Sections Provide an Answer

From the cross-sections below it is clear that in thermal cycling there are significant differences between the SN100C (Sn-0.7Cu-0.05Ni+Ge) and the Sn-3.8Ag-0.7Cu alloy. Cracks started to appear in the latter alloy after 2000 cycles with compete failure at by 4000 cycles. In the joints made with SN100C, there was no significant cracking until 4000 cycles. The conclusion is that SN100C has excellent resistance to thermal fatigue.

Nihon Superior is proud to present the case for implementing lead-free soldering at lower cost and higher reliability with its silver-free SN100C. 

Comparison of the Incidence of Failure in a Surface Mount device

Test Conditions

Thermal Cycling:-45°C 15 min dwell/+125°C 25 min dwell
Board:FR-4 Immersion tin finish

SN100C-Reliable Joints
Long Service Life under Conditions of Thermal Cycling

http://www.nihonsuperior.co.jp/english/sn100c/pdf/040106_1_heatcycle.pdf


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.

Mar 18, 2024 -

Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024

Nov 13, 2023 -

Nihon Superior's Keith Sweatman Wins a Coveted SMTA International Best Paper Award

Nov 06, 2023 -

Nihon Superior and FCT Solder Extend Partnership with SN100CV License Agreement

Oct 02, 2023 -

Nihon Superior's Mr. Keith Sweatman to Present at the 2023 SMTA International Technical Conference

Sep 11, 2023 -

Nihon Superior to Highlight SN100CV P608 Paste at SMTAI

Jan 09, 2023 -

Nihon Superior Launches Ag-free SAC305 Replacement – SN100CV

Dec 21, 2022 -

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Nov 15, 2022 -

Nihon Superior Introduces Lead-Free Solder Paste for Automotive Requirements

Oct 06, 2022 -

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Jan 03, 2022 -

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

152 more news from Nihon Superior Co., Ltd. »

May 23, 2024 -

A shield of Conformal Coating, the unsung hero that could have thwarted rust's encroaching fate.

May 21, 2024 -

GPD Global Precision Fluid Dispensing Systems Successful IPC APEX 2024

May 21, 2024 -

Unlock the Potential of Precision: Discover Our Expert PCBA Manufacturing!

May 20, 2024 -

Indium Corporation Experts to Present on Power Electronics at PCIM Europe

May 20, 2024 -

Indium Corporation Experts to Present at Electronics in Harsh Environments SMTA Conference.

May 20, 2024 -

Indium Corporation Expert to Present on Alternative Solder Alloys to Solve Emerging Challenges at SMTA Rocky Mountain Expo & Tech Forum

May 20, 2024 -

Saki Set to Highlight Cutting-Edge Inspection Technology at SMTConnect 2024

May 20, 2024 -

TRI opens New Manufacturing Facility

May 20, 2024 -

Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC

May 20, 2024 -

Altus Adds PVA's Game Changing PathMaster X Software to Portfolio

See electronics manufacturing industry news »

Reliability of Lead-Free Solder Joints in Thermal Cycling news release has been viewed 1770 times

Jade Series Selective Soldering Machines

Fluid Dispensing, Staking, TIM, Solder Paste