Nihon Superior USA Exhibits SN100C at IPC International Conference on Flexible Circuits 2008

OSAKA, JAPAN � February 13, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it showcased its SN100C products with FCT Assembly, one of its US SN100C Global Partners, at the IPC International Conference on Flexible Circuits, that took place February 13, 2008 in Phoenix, Ariz.

With its unique tin-copper-nickel-germanium alloy SN100C now firmly established as one of the global electronics industry�s most popular lead-free wave soldering alloys. It has also been found its properties make SN100C an ideal choice for reflow and hand soldering applications.

The fluidity of SN100C, which is comparable to that of tin-lead, is one of the factors that contribute to excellent hole fill and minimal shorts in wave soldering. However, that property is also an advantage in hand soldering where, in combination with the right core flux , it makes possible the completion of more than 35 average joints per minute with a tip temperature of only 380�C. Nihon Superior is now offering the eCore low-spatter lead-free flux-cored solder wire.

The 227�C melting point of SN100C was first thought to preclude its use in reflow soldering but when it was noted that tin-silver-copper alloys (such as SAC305 with a melting point of 217-218�C) are typically reflowed with a peak temperature around 240�C, it was realized that SN100C could be a drop-in replacement. Its high fluidity and excellent wetting properties mean that SN100C can be reflowed successfully at a lower superheat above liquidus than SAC alloys. Nihon Superior now offers SN100C no-clean ePaste for general reflow purposes.