Jan 23, 2009 
The solder spheres are extremely reliable because of their excellent impact strength, and they are suitable for BGA, CSP, MCM and high-density fine-pitch applications. SN100C spheres have a smooth surface free of shrinkage effects. The spheres' high ductility ensures high impact strength. Additional features include stable intermetallic compound and slow growth of interfacial intermetallic.
For more information about the new SN100C high-reliability lead-free solder spheres product line, visit http://www.nihonsuperior.co.jp.
About Nihon Superior Co. Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.
