Sep 03, 2013 SEHO North America, Inc. announces a two-day seminar from the SEHO Academy, scheduled to take place September 18-19, 2013 in Cincinnati, Ohio. The event has been organized in cooperation with John Borneman from Delphi Electronics and Safety, Friedrich-Alexander University Erlangen Nuremberg, the Balver Zinn Group Germany and Pink GmbH Germany.
The first day of the seminar will focus on the “Reflow Soldering Process – Now and in the Future.” Reflow experts Andreas Reinhardt, Stan Renals and Andrea Althaus will discuss new and existing trends and materials in reflow soldering. A particular focus will be on void-free solder connections.
The second day will concentrate on selective and wave soldering, providing comprehensive process knowledge. A special focus will be on practical hands-on training and equipment maintenance. After the introductory presentation from John Borneman the attendees will be separated in two workshop groups focusing on either selective or wave soldering.
As part of the successful SEHO Academy with more than 1,000 satisfied attendees worldwide, the event will highlight latest technology for quality enhancement. As a result, participants will realize a higher level of profitability.
For more information, visit www.sehona.com.
Since its foundation in 1973, SEHO has become the worldwide contact partner whenever soldering is involved. Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. As a result, all applicable environmental standards are complied with meticulously. With its systems, the company provides customers with a sustained and resource economizing production facility. It continuously develops its technology in order to provide customers with a competitive advantage. For more information, visit www.seho.de.
