Jan 12, 2019 
SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, today announced that Andreas Reinhardt, Ph.D., will present during Session S34, entitled, “Assembly/Emerging Technologies” during the IPC APEX EXPO. The presentation entitled, “Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers” will take place on Thursday, Jan. 31, 2019 from 10:30 a.m. – 12 p.m.
As the reflow soldering process is the main energy consumer in an SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Melting the solder only requires a tiny percentage of heat, most of the energy is wasted to heat up the machine itself. If it would be possible to heat up only the solder joints to the required temperature, the energy reduction will be substantial. The crucial factor for such a process is to use a conductive heating material layer inside the printed circuit board (PCB) and generate the heat from inside by joule heating.
In the joint research project, “ERFEB” (Energy and Resource efficient Production of Electronic Assemblies), a current control unit will be designed and tested for different numbers of connections and different structures of heating layers to achieve a reliable reflow profile for a PCB soldering process. In this paper, the PCB build-up and the experimental setup will be described and the results of soldering tests will be presented.
Dr. Reinhardt has been the Director of Research and Development at SEHO Systems GmbH since 2014.
After his studies in mechatronics at the University of Erlangen-Nuremberg he worked at the Institute for Factory Automation And Production Systems (FAPS) in Nuremberg from 2006 to 2013, responsible for the research group 'electronics production' since 2011.
The SEHO team is looking forward to welcoming visitors to Booth #2933 during the IPC APEX EXPO. For more information, visit www.seho.de.
