Jan 17, 2012 
The Balver Zinn Group announces that Cobar Solder Products Inc. will introduce its new Halogen and Halide Free Solder Paste, Cobar OT2, in Booth #1709 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.
The newly designed flux medium for solder paste has unique properties that eliminate defects related to oxidation and miniaturization. Smaller pitch sizes and components require less solder paste; however, the paste has enough activation to meet modern process requirements.
Cobar OT2 is halogen and halide-free, and is available with low-cost alloys such as SN100C or SCANGe-071. These solder pastes have no or low silver amounts and are ideal for cost driven markets but the Cobar OT2 is also available in SAC305. The rosin-based flux medium makes printing very easy even at very high print speeds (>200 mm/sec).
Due to its outstanding activation system, the paste eliminates Head-in-Pillow defects that are critical in lead-free soldering of BGAs. Even with the smallest components, such as 01005 or 0201s, this paste does not show graping or defects. It provides perfect wetting conditions for the most reliable solder joints.
The Balver Zinn/Cobar team has experts with decades of experience in all types of reflow applications. Engineers are available to provide support whenever special attention is needed to optimize the process. For detailed studies on metallurgy and/or chemistry, the company uses its well-equipped laboratories in Balve (D) and Breda (NL).
Cobar Solder Products is the U.S. division of the Balver Zinn/Cobar Group.
