Jan 21, 2015 
Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit in Booth #2935 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Surface-mount components may warp during the reflow process, as well as the associated land area. This warpage between components and the land area can contribute to defects such as Head-on-Pillow, shorts and opens. Fully understanding the critical interface between surfaces is more important than ever.
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, and graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.
For more information, meet company representatives in Booth #2935 at the IPC APEX EXPO or visit www.akrometrix.com.
Akrometrix LLC, the leader in elevated temperature surface characterization, was founded in 1993 by Dr. Charles Ume, a Professor and Director of the Advanced Electronic Packaging and Laser Processing Laboratory, at the George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia. Headquartered in Atlanta, Akrometrix supports over 250 equipment installations worldwide. For more information, contact Akrometrix at info@akrometrix.com.
